6052E低热膨胀系数聚酰亚胺薄膜是由新型酐单体及新型胺单体的新配方制成的聚酰氨酸树脂，经双向拉伸工艺生产的新型亚胺薄膜，它不仅具有普通聚酰亚胺薄膜的所有优异性能，且具有更高的尺寸稳定性，高弹性模量及低热膨胀系数。
6052E低热膨胀系数聚酰亚胺薄膜 的详细介绍
一、技术要求：
1、厚度与宽度
| 标称厚度 | 12.5 | 25.0 |
| 允许偏差 | +1/-1 | +1/-2 |
| ≤520 | ≤520 | |
| 注：厚度也可根据用户要求供应。 | ||
2、性能指标
序号 | 指标名称 | 单位 | 指标值 | ||
12.5μm | 25.0μm | ||||
1 | 拉伸强度 | 纵向及横向 | MPa | ≥200 | |
2 | 断裂伸长度率 | 纵向及横向 | % | ≥40 | |
| 3 | 拉伸模量 | 纵向及横向 | GPa | ≥4.0 | |
4 | 热收缩率 纵向及横向 | % | ≤0.1 | ||
5 | 工频电气强度 | 平均值 | MV/m | ≥200 | |
6 | 热膨胀系数 25-200℃ | ppm/℃ | 15-25 | ||
吸湿性 100%RH | % | ≤2.5 | |||
7 | 体积电阻率200℃ | Ω·M | ≥1.0X1012 | ||
8 | 相对介电常数48-62Hz | -- | 3.0-3.5 | ||
9 | 介质损耗因数48-62Hz | -- | ≤0.002 | ||
6052E低热膨胀系数聚酰亚胺薄膜
二、应用领域
6025E低热膨胀系数聚酰亚胺薄膜其尺寸稳定性高，CTE与铜箔相近特别适用于FPC行业制作覆筒板需要。
6052E Low Expansion Coefficient Polyimide Film
With the application of Bi-axial stretching Technology, this brand polyimide film, the low thermal expansion coefficient polyimide film, is made from polyamic acid resins, which is obtained from a novel formula comprised of new anhydride monomers as well as a mine monomers. It not only processes good performance of ordinary polyimide film but also has better dimension stability, higher modulus of elasticity and lower heat expansion coefficient.
1. Technical Requirement
1.1 Thickness and Width
Thickness | 12.5 | 25.0 |
Tolerance | +1/-1 | +1/-2 |
| Width | ≤520 | ≤520 |
Notes: Thickness is supplied as the requests of customer | ||
1.2 Performace Index
No. | Index | Unit | Index Value | ||
12.5μm | 25.0μm | ||||
1 | Tensile | CD / MD | MPa | ≥200 | |
2 | Elongation | CD / MD | % | ≥40 | |
3 | Tensile modulus | CD / MD | GPa | ≥4.0 | |
| 4 | Heat expansion coefficient | % | ≤0.1 | ||
| 5 | Electrical operating frequency intensity | Average | MV/m | ≥200 | |
| 6 | Heat expansion coefficient 25-200℃ | ppm / ℃ | 15-25 | ||
5 | A wet sexual 100% RH | % | ≤2.5 | ||
6 | Volume resistivity 200℃ | Ω ·cm | ≥1.0X1012 | ||
7 | Relative dielectric constant 48-62Hz | -- | 3.0-3.5 | ||
8 | Dielectric loss factor 48-62Hz | -- | ≤0.002 | ||
2. Application
6052E low expansion coefficient polyimide film processes higher dimension stability. Its CTE is very near copper foil which is ideal material for FPC as copper board cover.
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